A3COM-HUAWEI-STACK-MIB

This MIB is used to manage STM (Stack Topology Management) information for IRF (Intelligent Resilient Framework) device. This MIB is applicable to products which support IRF. Some objects in this MIB may be used only for some specific products, so users should refer to the related documents to acquire more detailed information.

MIB content (30 objects)

Informations

Organization
Hangzhou H3C Technologies Co., Ltd.
Contact info
Platform Team H3C Technologies Co., Ltd. Hai-Dian District Beijing P.R. China Http://www.h3c.com Zip:100085

Revisions

2008-04-30 16:50
The initial revision of this MIB module.